[IEEE 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) - Chengdu, China (2016.7.20-2016.7.22)] 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) - Bias-dependent high frequency characterization of through-silicon via (TSV) for 3D integration

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