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[IEEE 2016 39th International Spring Seminar on Electronics Technology (ISSE) - Pilsen, Czech Republic (2016.5.18-2016.5.22)] 2016 39th International Spring Seminar on Electronics Technology (ISSE) - The mechanical strength of solder joints on PCB with OSP surface protection
Novotny, Vaclav, Adamek, Martin, Skacel, Josef, Sandera, Josef, Vala, RadekYear:
2016
Language:
english
DOI:
10.1109/ISSE.2016.7563199
File:
PDF, 706 KB
english, 2016