[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Surface Treatment to Enable Low Temperature and Pressure Copper Direct Bonding
Dubey, V., Derakhshandeh, J., Beyne, E., Gerets, C., Cooper, E., Laermans, P., Leersnijder, K. D., Baumans, K., Rebibis, K. J., Miller, A., Wolf, I. DeYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.235
File:
PDF, 1.06 MB
english, 2016