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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - The study of Cu-Cu low temperature bonding using formic acid treatment with/without Pt catalyst
Yang, Wenhua, Lu, Yangting, Tadatomo, SugaYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583247
File:
PDF, 683 KB
english, 2016