Subsurface crack damage in silicon wafers induced by resin...

Materials Science in Semiconductor Processing 2017 / 01 Vol. 57

Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

Liu, Tengyun, Ge, Peiqi, Bi, Wenbo, Gao, Yufei
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Volume:
57
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2016.10.021
Date:
January, 2017
File:
PDF, 1.32 MB
english, 2017
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