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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Biopackaging of Intracranial Pressure Microsystem for Multimodality Neuro Monitoring of Severe Head Injury Patients
Damalerio, Ramona, Tan, Kwan Ling, Lim, Ruiqi, Chen, Weiguo, Gao, Yuan, Xue, Ning, Cheng, Ming-Yuan, Rao, Jai PrashanthYear:
2016
Language:
english
DOI:
10.1109/ECTC.2016.158
File:
PDF, 564 KB
english, 2016