Dopant, composition and carrier profiling for 3D structures

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Materials Science in Semiconductor Processing 2016 / 10

Dopant, composition and carrier profiling for 3D structures

Vandervorst, W., Fleischmann, C., Bogdanowicz, J., Franquet, A., Celano, U., Paredis, K., Budrevich, A.
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Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2016.10.029
Date:
October, 2016
File:
PDF, 2.21 MB
english, 2016
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