Experimental Study on the Effects of Eutectic Voids on the...

IEEE Transactions on Components Packaging and Manufacturing Technology 2016 / 10 Vol. 6; Iss. 10

Experimental Study on the Effects of Eutectic Voids on the Thermal Performance Within Flip-Chip Ultraviolet Light-Emitting Diodes

Liang, Renli, Zhang, Jun, Wang, Shuai, Ding, Taotao, Dai, Jiangnan, Chen, Changqing
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Volume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2016.2604019
Date:
October, 2016
File:
PDF, 1.97 MB
english, 2016
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