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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Enhanced thermal conductivity and mechanical properties of epoxy resin-alumina-silicon carbide fibers three-phase composites
Zeng, Xiaoliang, Guo, Kun, Yu, Shuhui, Sun, Rong, Xu, Jian-binYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583116
File:
PDF, 1.01 MB
english, 2016