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Galvanic corrosion of Cu coupled to Au on a print circuit board; Effects of pretreatment solution and etchant concentration in organic solderability preservatives soft etching solution
Oh, SeKwon, Kim, YoungJun, Shon, MinYoung, Kwon, HyukSangVolume:
22
Language:
english
Journal:
Metals and Materials International
DOI:
10.1007/s12540-016-6124-4
Date:
September, 2016
File:
PDF, 1.23 MB
english, 2016