An investigation of microstructure and properties of...

Soldering & Surface Mount Technology 2016 / 04 Vol. 28; Iss. 2

An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl 2 O 3 composite solder

Chen, Guang, Huang, Bomin, Liu, Hui, Chan, Y.C., Tang, Zirong, Wu, Fengshun
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Volume:
28
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-08-2015-0027
Date:
April, 2016
File:
PDF, 682 KB
english, 2016
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