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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - A full chip scale numerical simulation method for thermal management of 3D IC
Wang, Ningyu, Jin, Yufeng, Pi, Yudan, Wang, WeiYear:
2016
Language:
english
DOI:
10.1109/ICEPT.2016.7583226
File:
PDF, 837 KB
english, 2016