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A model-based prognostic approach to predict interconnect failure using impedance analysis
Kwon, Daeil, Yoon, JeongahVolume:
30
Language:
english
Journal:
Journal of Mechanical Science and Technology
DOI:
10.1007/s12206-016-0910-2
Date:
October, 2016
File:
PDF, 453 KB
english, 2016