Microstructures and properties of Al–50%SiC composites for...

Transactions of Nonferrous Metals Society of China 2016 / 10 Vol. 26; Iss. 10

Microstructures and properties of Al–50%SiC composites for electronic packaging applications

TENG, Fei, YU, Kun, LUO, Jie, FANG, Hong-jie, SHI, Chun-li, DAI, Yi-long, XIONG, Han-qing
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Volume:
26
Language:
english
Journal:
Transactions of Nonferrous Metals Society of China
DOI:
10.1016/S1003-6326(16)64358-3
Date:
October, 2016
File:
PDF, 2.23 MB
english, 2016
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