Au / SiO2 Hybrid Bonding with 6- m-Pitch Au Electrodes for...

ECS Transactions 2016 / 09 Vol. 75; Iss. 9

Au / SiO2 Hybrid Bonding with 6- m-Pitch Au Electrodes for 3D Structured Image Sensors

Honda, Y., Hagiwara, K., Goto, M., Watabe, T., Nanba, M., Iguchi, Y., Saraya, T., Kobayashi, M., Toshiyoshi, H., Higurashi, E., Hiramoto, T.
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Volume:
75
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/07509.0103ecst
Date:
September, 2016
File:
PDF, 523 KB
english, 2016
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