Void dynamics in lead-free Sn-Ag-Cu solder joints

Void dynamics in lead-free Sn-Ag-Cu solder joints

Werner, Marek, Reppel, Thomas, Weinberg, Kerstin
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Volume:
16
Language:
english
Journal:
PAMM
DOI:
10.1002/pamm.201610296
Date:
October, 2016
File:
PDF, 571 KB
english, 2016
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