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Constitutive modeling of solder alloys for drop-impact applications
Wong, E.H., Chrisp, J., Selvanayagam, C.S., Seah, S.K.W.Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.10.007
Date:
October, 2016
File:
PDF, 1.13 MB
english, 2016