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Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging
Reddy, Jayaprakash, Pratap, RudraVolume:
27
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/27/1/015005
Date:
January, 2017
File:
PDF, 1.93 MB
english, 2017