Combined loading and failure analysis of lead-free solder...

Soldering & Surface Mount Technology 2014 / 01 Vol. 26; Iss. 1

Combined loading and failure analysis of lead-free solder joints due to creep and fatigue phenomena

Agata Skwarek, Dr, Jankowski, Krystian, Wymyslowski, Artur, Chicot, Didier
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Volume:
26
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/ssmt-10-2013-0029
Date:
January, 2014
File:
PDF, 277 KB
english, 2014
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