Enhanced thermal fatigue endurance and lifetime prediction...

Soldering & Surface Mount Technology 2011 / 04 Vol. 23; Iss. 2

Enhanced thermal fatigue endurance and lifetime prediction of lead‐free LGA joints in LTCC modules

Nousiainen, O., Salmela, O., Putaala, J., Kangasvieri, T.
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Volume:
23
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911111120177
Date:
April, 2011
File:
PDF, 390 KB
english, 2011
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