Wafer-level fabrication of a high-silica v-groove for fiber-optic packaging using deep dry-etching with a dual-frequency high-density plasma
Ha, Tae-Won, Heo, Gi-Seok, Choi, Bum-Ho, Kim, Young-Baek, Oh, Jin-Kyoung, Lee, Hyung-JongVolume:
67
Language:
english
Journal:
Journal of the Korean Physical Society
DOI:
10.3938/jkps.67.1179
Date:
October, 2015
File:
PDF, 1.69 MB
english, 2015