[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Study on copper diffusion barrier materials by Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)
Wang, Yun, Teo, Han Wei, Ong, Kian Kok, Mo, Zhi Qiang, Zhao, Si PingYear:
2016
DOI:
10.1109/IPFA.2016.7564266
File:
PDF, 137 KB
2016