High-Frequency Testing of Vertical Interconnection Array...

IEEE Transactions on Components Packaging and Manufacturing Technology 2016 / 11 Vol. 6; Iss. 11

High-Frequency Testing of Vertical Interconnection Array Using Indirect Contact Probing Method With an Improved Calibration

Jeong, Jongwoo, Kim, Jingook, Kang, No-Weon, Han, Ki Jin
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Volume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2016.2613823
Date:
November, 2016
File:
PDF, 3.89 MB
english, 2016
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