Silver Adhesive Layer for Enhanced Pressure-Free Bonding Using Copper Nanoparticles
Satoh, Toshikazu, Ishizaki, Toshitaka, Akedo, KunioLanguage:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-5106-0
Date:
November, 2016
File:
PDF, 2.46 MB
english, 2016