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Flip chip assembly of thinned chips for hybrid pixel detector applications
Fritzsch, T, Zoschke, K, Woehrmann, M, Rothermund, M, Huegging, F, Ehrmann, O, Oppermann, H, Lang, K DVolume:
9
Language:
english
Journal:
Journal of Instrumentation
DOI:
10.1088/1748-0221/9/05/C05039
Date:
May, 2014
File:
PDF, 2.07 MB
english, 2014