Electrothermal Modeling for 3-D Nanoscale Circuit...

IEEE Transactions on Components Packaging and Manufacturing Technology 2016 / 7 Vol. 6; Iss. 7

Electrothermal Modeling for 3-D Nanoscale Circuit Substrates: Noise

Ma, Yue, Fakri-Bouchet, Latifa, Calmon, Francis, Gontrand, Christian
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Volume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2016.2575363
Date:
July, 2016
File:
PDF, 1.90 MB
english, 2016
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