Characterization of Ultrasonic Wire Bonding for LDS MID...

IEEE Transactions on Components Packaging and Manufacturing Technology 2016 / 11 Vol. 6; Iss. 11

Characterization of Ultrasonic Wire Bonding for LDS MID Prototyping

Kanthamneni, Akhil, Brose, Andreas, Majcherek, Soren, Brinkhues, Sven, Aman, Alexander, Schmidt, Bertram
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Volume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2016.2617080
Date:
November, 2016
File:
PDF, 2.52 MB
english, 2016
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