Effect of electron flow on the microstructure and...

Effect of electron flow on the microstructure and mechanical property of Cu/Sn–30Bi/Cu solder joint

Lai, Zhongmin, Kong, Xinda, You, Qingrong
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Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-6085-x
Date:
November, 2016
File:
PDF, 2.56 MB
english, 2016
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