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Effect of Ti content on the wetting behavior of Sn0.3Ag0.7Cu/AlN system
Fu, W., Song, X.G., Zhao, Y.X., Cao, J., Feng, J.C., Jin, C., Wang, G.D.Volume:
115
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2016.11.041
Date:
February, 2017
File:
PDF, 2.00 MB
english, 2017