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Low-temperature low-cost 58 Bismuth – 42 Tin alloy forensic chip re-balling and re-soldering
Heckmann, Th., Souvignet, Th., Lepeer, S., Naccache, D.Volume:
19
Language:
english
Journal:
Digital Investigation
DOI:
10.1016/j.diin.2016.10.003
Date:
December, 2016
File:
PDF, 4.94 MB
english, 2016