[IEEE 2016 12th International Congress Molded Interconnect Devices (MID) - Wuerzburg, Germany (2016.9.28-2016.9.29)] 2016 12th International Congress Molded Interconnect Devices (MID) - LDS manufacturing technology for next generation radio frequency applications
Friedrich, Aline, Geck, Bernd, Fengler, MalteYear:
2016
Language:
english
DOI:
10.1109/icmid.2016.7738939
File:
PDF, 782 KB
english, 2016