Analytical models for the thermal strain and stress induced...

IEICE Electronics Express 2013 Vol. 10; Iss. 20

Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV)

Wang, Fengjuan, Zhu, Zhangming, Yang, Yintang, Liu, Xiaoxian, Ding, Ruixue
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
10
Year:
2013
Language:
english
Journal:
IEICE Electronics Express
DOI:
10.1587/elex.10.20130666
File:
PDF, 1.49 MB
english, 2013
Conversion to is in progress
Conversion to is failed