MSP based thermal-aware mapping approach for 3D...

MSP based thermal-aware mapping approach for 3D Network-on-Chip under performance constraints

Feng, Gui, Ge, Fen, Wu, Ning, Zhou, Lei, Liu, Jing
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Volume:
13
Year:
2016
Language:
english
Journal:
IEICE Electronics Express
DOI:
10.1587/elex.13.20160082
File:
PDF, 1.89 MB
english, 2016
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