Thermal and competition aware mapping for 3D network-on-chip
Zhang, Bixia, Gu, Huaxi, Yang, Yintang, Wang, Kun, Wang, ZhengyuVolume:
9
Year:
2012
Language:
english
Journal:
IEICE Electronics Express
DOI:
10.1587/elex.9.1510
File:
PDF, 346 KB
english, 2012