![](/img/cover-not-exists.png)
Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration
HIGURASHI, Eiji, YAMAMOTO, Michitaka, SATO, Takeshi, SUGA, Tadatomo, SAWADA, RenshiVolume:
E99.C
Year:
2016
Language:
english
Journal:
IEICE Transactions on Electronics
DOI:
10.1587/transele.e99.c.339
File:
PDF, 1.34 MB
english, 2016