[IEEE 2016 12th International Congress Molded Interconnect Devices (MID) - Wuerzburg, Germany (2016.9.28-2016.9.29)] 2016 12th International Congress Molded Interconnect Devices (MID) - Randomly shaped 3D electronics using innovative combination of standard surface mount technologies and polymer processing
Tenchine, Lionel, Dassonville, OlivierYear:
2016
Language:
english
DOI:
10.1109/icmid.2016.7738937
File:
PDF, 449 KB
english, 2016