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Heat transfer in a channel between vertical electronic circuit boards cooled by natural air convection.
Kato, Kunio, Takarada, Takayuki, Miyazaki, Hiroshi, Sato, Hajime, Nakagawa, NobuyoshiVolume:
24
Year:
1991
Journal:
JOURNAL OF CHEMICAL ENGINEERING OF JAPAN
DOI:
10.1252/jcej.24.568
File:
PDF, 978 KB
1991