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Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device
NAGANO, Kohta, YAGUCHI, Akihiro, TERASAKI, Takeshi, YAMADA, MunehiroVolume:
71
Year:
2005
Language:
english
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.71.177
File:
PDF, 7.04 MB
english, 2005