[IEEE 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Shenzhen, China (2016.5.17-2016.5.21)] 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Fast correlations of pre-silicon integrated chip-package-board DDR4-2133 memory channel simulations with silicon measurements via active signal probing - a case study
Koay Soon Chan,, Wei Khoon Teng,Year:
2016
Language:
english
DOI:
10.1109/apemc.2016.7522740
File:
PDF, 1.30 MB
english, 2016