Fatigue Crack Propagation Analysis for Micro Solder Joints with Void
TERASAKI, Takeshi, TANIE, HisashiVolume:
1
Year:
2007
Language:
english
Journal:
Journal of Solid Mechanics and Materials Engineering
DOI:
10.1299/jmmp.1.169
File:
PDF, 2.54 MB
english, 2007