Fatigue Crack Propagation Analysis for Micro Solder Joints...

Fatigue Crack Propagation Analysis for Micro Solder Joints with Void

TERASAKI, Takeshi, TANIE, Hisashi
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Volume:
1
Year:
2007
Language:
english
Journal:
Journal of Solid Mechanics and Materials Engineering
DOI:
10.1299/jmmp.1.169
File:
PDF, 2.54 MB
english, 2007
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