Influences of Microstructure and Specimen Size on Creep...

Journal of Solid Mechanics and Materials Engineering 2007 Vol. 1; Iss. 2

Influences of Microstructure and Specimen Size on Creep Properties of Solders

OGAWA, Takeshi, KOHKETSU, Hideyuki, TAKAHASHI, Kyouhei, OHSAWA, Tadashi
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Volume:
1
Year:
2007
Language:
english
Journal:
Journal of Solid Mechanics and Materials Engineering
DOI:
10.1299/jmmp.1.253
File:
PDF, 904 KB
english, 2007
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