Quantitative Evaluation of Moisture in Encapsulant Resin of...

JSME International Journal Series A 2004 Vol. 47; Iss. 3

Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwaves

JU, Yang, OHNO, Yasushi, SAKA, Masumi, ABÉ, Hiroyuki
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Volume:
47
Year:
2004
Language:
english
Journal:
JSME International Journal Series A
DOI:
10.1299/jsmea.47.294
File:
PDF, 257 KB
english, 2004
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