Parametric Study on the Thermal Response of Electronic...

Parametric Study on the Thermal Response of Electronic Components during Infrared Reflow Soldering.

SON, Young-Seok, SHIN, Jee-Young
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
46
Year:
2003
Journal:
JSME International Journal Series B
DOI:
10.1299/jsmeb.46.308
File:
PDF, 621 KB
2003
Conversion to is in progress
Conversion to is failed