Robust Thermal Design for Power Device Package Using Response Surface Method and Monte Carlo Simulation
YOKONO, Yasuyuki, HISANO, Katsumi, HIROHATA, KenjiVolume:
3
Year:
2008
Language:
english
Journal:
Journal of Thermal Science and Technology
DOI:
10.1299/jtst.3.452
File:
PDF, 545 KB
english, 2008