Residual stress in resin-molded IC chips.

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 1989 Vol. 55; Iss. 516

Residual stress in resin-molded IC chips.

MIURA, Hideo, NISHIMURA, Asao, KAWAI, Sueo, NISHI, Kunihiko
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Volume:
55
Year:
1989
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.55.1763
File:
PDF, 918 KB
1989
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