Prediction of residual stress in LSI plastic packages by...

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 1990 Vol. 56; Iss. 525

Prediction of residual stress in LSI plastic packages by thermoviscoelastic analysis for a 3-layer laminated beam.

NAKAMURA, Shozo, KANEDA, Aizo, NISHI, Kunihiko, MIYANO, Yasushi
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Volume:
56
Year:
1990
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.56.1209
File:
PDF, 768 KB
1990
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