![](/img/cover-not-exists.png)
A Method of Determining Reliability Testing Conditions for Solder Joints of Electronic Devices.
KITANO, Makoto, KUMAZAWA, Tetsuo, HONDA, Michiharu, HIROTA, KazuoVolume:
62
Year:
1996
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.62.1464
File:
PDF, 795 KB
1996