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Creep-Fatigue Life Evaluation of Solder Based on Creep Characteristics.
TANEDA, Motoharu, KAMINISHI, Ken, MOTOHIRO, SeijiVolume:
64
Year:
1998
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.64.50
File:
PDF, 919 KB
1998