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Recent Progress of Experimental and Measuring Technology. Evaluation of Crack Propagation for Sn63-Pb37 Solder Bumps.
MUKAI, Minoru, TAKAHASHI, Hiroyuki, KAWAKAMI, Takashi, TAKAHASHI, Kuniaki, KISHIMOTO, Kikuo, SHIBUYA, ToshikazuVolume:
67
Year:
2001
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.67.483
File:
PDF, 839 KB
2001