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Measurement of Biaxial Stress Using Grown Grain Density Rate in Electrodeposited Copper Foil with a Microcircular Hole.
KITAOKA, Seiichiro, ONO, Yuichi, NAKAGAWA, MasaakiVolume:
69
Year:
2003
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.69.565
File:
PDF, 799 KB
2003